Technology
3D Heterogeneous Integration with AGPT™
ED2 pioneered the use of fused silica in heterogeneous semiconductor packaging, branded as Advanced Glass Packaging Technology (AGPT™).
Heterogeneous packaging integrates multiple semiconductor materials or device types—like silicon with compound semiconductors—into a single package. This approach enables greater functional density, performance optimization, and reduced system size and complexity compared to traditional homogeneous packaging.
Common formats include System-in-Package (SiP) and Multi-Chip Modules (MCM), used across smartphones, computing, and industrial electronics.
Key material advantages of fused silica:
- High temperature resistance
- Low dielectric loss
- Radiation hardness
- Low outgassing
- Excellent CTE match
- Scalable manufacturing
Telecom Infrastructure
ED2’s technology portfolio includes high-performance mmWave and C-band repeaters designed to boost 5G coverage in challenging indoor and outdoor environments. Licensed by Wilson Connectivity, these repeaters enable fast, cost-effective network expansion into hard-to-reach areas.
At the core is a flexible architecture that captures 5G RF signals, performs frequency translation to intermediate frequency (I/F), transmits via coax to a remote unit, then amplifies and re-broadcasts the signal. This system overcomes blockers like dense materials or terrain, ensuring reliable, high-speed 5G connectivity for enterprise and urban deployments
Advanced Antenna Systems
The FreeStar5G Advanced Antenna System was developed by ED2 and licensed to Freefall 5G. The product takes an innovative and disruptive approach to signal distribution. Rather than incorporate 10s to 100s of individual antenna modules onto a large panel, each module tasked and limited to support a single UE, the FF5G approach uses patented dielectric waveguide antenna (DWA) technology to deliver instant coverage across the entire field of users. An integrated switch matrix allows the signals to be switched or directed in any multitude of ways, to support a wide variety of applications.
Benefits
Beam pointing rather than beam forming
Wide area coverage
No moving parts
EIRP +50 dBm
SU-MIMO and MU-MIMO ready
Built in software-defined Power Control and Beam Steering logic
